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Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology samsung

Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology

February 21, 2020

Samsung Electronics, a international chief in advanced semiconductor generation, today announced that it has advanced the industry’s first 12-layer 3-d-TSV (Through Silicon Via) generation.Samsung’s …

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