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samsung
Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology
Samsung Electronics, a international chief in advanced semiconductor generation, today announced that it has advanced the industry’s first 12-layer 3-d-TSV (Through Silicon Via) generation.Samsung’s …
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silicon
Samsung Showcases Its Latest Silicon Technologies for the Next Wave of Innovation at Annual Tech Day
Samsung Electronics Co., Ltd., a global leader in superior semiconductor technology, showcased superior reminiscence and system good judgment devices at its Tech Day 2019 event. Fueling the future of…
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wins
Samsung Wins 46 CES 2020 Innovation Awards for Outstanding Design and Engineering
Samsung Electronics Co., Ltd., a international chief in era, announced these days that 46 of its new product improvements have been recognized as CES® 2020 Innovation Awards winners, which includes 3…
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